The Brazing Behavior of Aluminum-Steel Cladding Strip with Pre-Cladded Brazing Layer Used in Air Cooling System of Power Plants

Nickel-chromium-based Amorphous Brazing Foils for Continuous Furnace Brazing of Stainless Steel

analysis of power in the network society

اندیشمندان و صاحب نظران علوم اجتماعی بر این باورند که مرحله تازه ای در تاریخ جوامع بشری اغاز شده است. ویژگیهای این جامعه نو را می توان پدیده هایی از جمله اقتصاد اطلاعاتی جهانی ، هندسه متغیر شبکه ای، فرهنگ مجاز واقعی ، توسعه حیرت انگیز فناوری های دیجیتال، خدمات پیوسته و نیز فشردگی زمان و مکان برشمرد. از سوی دیگر قدرت به عنوان موضوع اصلی علم سیاست جایگاه مهمی در روابط انسانی دارد، قدرت و بازتولید...

Effect of Welding Heat Input on the Intermetallic Compound Layer and Mechanical Properties in Arc Welding-brazing Dissimilar Joining of Aluminum Alloy to Galvanized Steel

The effect of weld heat input on the formation of intermetallic compound (IMCs) layer during arc welding–brazing of aluminium and steel dissimilar alloys, was investigated through both finite element method (FEM) numerical simulations and experimental measurements. The results of FEM analysis as well as welding experiments indicated that increasing weld heat input increases the thickness of IMC...

Brazing & Soldering Today

Brazed components play an essential role in consistent joining techniques. The brazing process is characterized by low process temperatures and fast processing times, compared to welding techniques. Beside the resulting low manufacturing costs, brazing can join dissimilar materials, e.g. metals and ceramics. Consequently, brazing provides potential for many industrial applications like the prod...

Brazing & Soldering Today

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...